Die (integrated circuit)

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A medium-scale integrated circuit die, with bond wiresattached.

A VLSI integrated-circuit die

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) through processes such as photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.^[1][2]

[edit]See also

Electronics portal

• Integrated circuit
• Semiconductor fabrication
• Wafer dicing
• Die preparation

[edit]References

1. ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 084931951X.
2. ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0122269306.

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